SHANGHAI, April 20, 2020 /PRNewswire/ -- BEKEN CORPORATION is a leading supplier of ETC chips in China. Its ETC IC product BK5870T has been formally mass-produced and has been certified by an international third-party laboratory, making it the first ETC SoC chip in China to pass this certification.

The minimum time to complete a regulation test is 145 days, according to industry standard specifications. This includes vehicle gauge wafer production, vehicle gauge package development, three-temperature testing and AEC-Q100 testing, of which at least three months are required for high-temperature operating life testing alone. The ISE laboratory that provided certification for the BK5870T is an authoritative international vehicle testing organization with a more stringent certification process, which proves that Beken's ETC products have fully passed this authoritative certification.

Beken has been a pioneer in the domestic ETC market. From the initial GB/T20851 national standard to the latest GB/T38444 standard, Beken has been deeply involved in the development of the ETC industry for a long time. The BK5863, a single RF BK5822, BK5823 and BK5824, as well as the BK5863, an integrated SoC, have all performed very well in the market. BK5870T is a brand-new ETC chip developed by the company in the field of ETC chip for more than ten years.

The product combines the understanding of China national standards and industry applications to meet the stringent requirements of product reliability in the automotive market, and inherits the system stability, compatibility, and solution maturity of the aftermarket, with leaps and bounds in performance and quality, capable of working continuously and reliably from -40 degrees Celsius to 105 degrees Celsius, fully meeting automotive standards. The BK5870T not only adopts a new design, packaging and test process, but also combines the company's Bluetooth series chips with the perspective of customers and end-users, constituting a complete ETC SoC solution with various options. It can provide a single-chip solution for the rapid and low-cost development of OBU systems and meet the secondary software development needs of customers' OBU systems.