In March 2019, the government work report clearly proposed to basically abolish the national highway provincial boundary toll stations within two years and realize non-stop express toll collection. In April 2020, the Ministry of Industry and Information Technology required that from July 1, 2020, new models applying for product access should add ETC on-board units in the optional configuration for users to choose; from January 1, 2021, new models applying for product access shall be equipped with ETC vehicle-mounted devices using direct power supply. Driven by the policy, ETC front-loading has become a major trend. This means that the front-mounted OBU technology has entered the national standard mandatory requirements, the product specifications have been upgraded to the vehicle specification level, and the requirements for the related chip quality and supplier qualification have been greatly enhanced.

In order to better meet the demand of ETC pre-installation and develop chip products that meet the requirements of vehicle regulations, Broadcom Integrated, based on more than ten years' accumulation of R&D and stable mass production experience in the field of ETC chips, has made a comprehensive upgrade specifically for the vehicle regulation process, using the most advanced and stable process in the industry, and selected experienced packaging and testing factories and adopted a new testing process for product development, and launched in 2020 the domestic The first ETC chip K5870T and Bluetooth chip BK3435T, which have passed the international third-party laboratory's vehicle specification test certification, were launched in 2020.

BK5870T combines Beken Corporation's understanding of national standards, industry applications, and the strict requirements of product reliability in the automotive specification market, inheriting system stability, compatibility, and solution maturity from the aftermarket, with leaps and bounds in performance and quality. It is able to work continuously and reliably from -40°C to 105°C, fully meeting the automotive specification standards. At the same time, Broadcom Integrated can also provide automotive-grade Bluetooth BK3435T, providing customers with a variety of options for developing OBU systems with a full set of ETC SoC solutions.

PENGFEI ZHANG,Chairman of Beken Corporation,pointed out that compared with the rear installation, the front installation ETC has to consider the compatibility and life cycle of the whole vehicle. To reach the Automotive Grade, it requires more in terms of product form, performance and stability. "The trend of front-mounted, both in terms of chip design, wafer production and package testing, has put forward more stringent requirements for ETC chips and related modules and solutions. According to the industry standard specification, the shortest time to complete a vehicle specification test is 145 days, which includes vehicle specification wafer production, vehicle specification package development, three-temperature test and AEC-Q100 test, etc.,including high temperature working life test will take at least 3 months." He stressed that "the ISE laboratory, which provides certification for the BK5870T, is an international authoritative automotive testing laboratory with a more stringent certification process,and Beken Corporation's products have fully passed this authoritative certification.

Zaidong Wang,General Manager of Lisson Automotive, said, "As a leading domestic ETC chip company, BK5870T reflects Beken Corporation's profound understanding of ETC protocols and technologies, Automotive Grade quality assurance, continuous iterative optimization capability and stable supply capability." He said, "Lisson Automotive has deep accumulation in quality control and supply chain, and has established stable and long-term supply relationship with domestic and foreign mainstream vehicle enterprises.

On the basis of satisfying the demand of automobile front-mounted ETC, Beken Corporation will realize more functional integration in the future, such as ETC with MCU control and Bluetooth connection, access to automobile CAN bus control system, bringing the potential of extended functions, etc. At the same time, the development, testing and industrialization of projects such as automotive specification high-precision global positioning chips and millimeter wave radar chips will be launched to further expand the company's market position and competitive advantages in areas such as intelligent transportation, laying a solid foundation for the company's future long-term development and long-term growth of performance.